JPS6457638U - - Google Patents
Info
- Publication number
- JPS6457638U JPS6457638U JP15208887U JP15208887U JPS6457638U JP S6457638 U JPS6457638 U JP S6457638U JP 15208887 U JP15208887 U JP 15208887U JP 15208887 U JP15208887 U JP 15208887U JP S6457638 U JPS6457638 U JP S6457638U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- brazing material
- semiconductor device
- ceramic package
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15208887U JPS6457638U (en]) | 1987-10-02 | 1987-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15208887U JPS6457638U (en]) | 1987-10-02 | 1987-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457638U true JPS6457638U (en]) | 1989-04-10 |
Family
ID=31426705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15208887U Pending JPS6457638U (en]) | 1987-10-02 | 1987-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457638U (en]) |
-
1987
- 1987-10-02 JP JP15208887U patent/JPS6457638U/ja active Pending